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作者

Song Ma Yiwen Chen Caoxu Wang Yan Li Yang Xu Yue Wu

作者单位

²University of Chinese Academy of Sciences, Beijing 100049, China ¹Shanghai Advanced Research Institute, Chinese Academy of Sciences, Shanghai 201210, China ⁴Chemical Biology Center, School of Pharmaceutical Sciences & Institute of Materia Medica, Shandong First Medical University & Shandong Academy of Medical Sciences, Jinan, Shandong 250117, China ⁵School of Mechanical Engineering, Hefei University of Technology, Hefei 230009, China ³LUBE-V Advanced Materials Technology (Shanghai) Co., LTD., Shanghai 271799, China

刊名

Materials Today Communications

年份

2025

卷号

Vol.46

页码

112547

ISSN

2352-4928

摘要

Chemical Mechanical Planarization is a crucial step in semiconductor fabrication, utilizing slurries including abrasives, and chemicals, including oxidizers, inhibitors and surfactants. The application of surfactants significantly enhances planarization efficiency, and minimizes defects. Despite their extensive application, the functional mechanisms remain insufficiently studied in recent advancements. To bridges this gap, this review firstly outlines the performance properties of CMP and slurr...更多

Chemical Mechanical Planarization is a crucial step in semiconductor fabrication, utilizing slurries including abrasives, and chemicals, including oxidizers, inhibitors and surfactants. The application of surfactants significantly enhances planarization efficiency, and minimizes defects. Despite their extensive application, the functional mechanisms remain insufficiently studied in recent advancements. To bridges this gap, this review firstly outlines the performance properties of CMP and slurry, followed by background information of surfactants. It then provides a comprehensive review of the application of surfactants across diverse material systems, with the in-depth analysis of the functional mechanism. Surfactants act as multi-functional additives that optimize mechanical friction and work synergistically with chemical reactions to achieve efficient material removal and high surface planarity. In addition, the synergistic effects between surfactants and other slurry components, followed by the adsorption and surface interaction characteristics, and we conclude by suggesting current insufficiency in the field to guide future innovative research and application.收起

文献类型

期刊